Proprietary patented “deep-etch” technology
80º sidewalls for up to 900nm thickness of LiNbO3 etching (loss < 0.3 dB/cm)
Photonic and RF circuits with scalable and high throughput fabrication techniques.
Our patented deep etching process allows extremely accurate dimensional control (40 nm tolerance) that facilitates a reliable Process Design Kit (PDK) library. Our PDK allows system-level design of photonic integrated circuits (PICs).
We offer Multi Project Wafer (MPW) runs that are either base-on or compatible with our PDK stack.
We process dedicated wafer runs based on customs designs or our PDK.
Optical & RF testing
Our fully-automated characterization setups allow full-chip optical and RF characterization.