Technology
Proprietary “deep-etch” technology
80º sidewalls for up to 900nm thickness of LiNbO3 etching (loss < 0.2 dB/cm)
Wafer-scale fabrication
Photonic and RF circuits with scalable and high throughput fabrication techniques.
Services
MPW runs
We offer Multi Project Wafer (MPW) runs that are either base-on or compatible with our PDK stack.
Dedicated Runs
We process dedicated wafer runs based on customs designs or our PDK.
Optical & RF testing
Our fully-automated characterization setups allow full-chip optical and RF characterization.
Verified Process Design Kit (PDK)
Low loss waveguides
20 dB/m (single mode) and < 10 dB/m (multimode)
Edge couplers
1.5 dB/facet loss (optical lensed fibers)
Resonators
Optical quality factor > 1 Mio
Low loss bends
Bending loss < 0.5%
Splitters / Combiners
Imbalance < 5%
Electro-optic phase modulators
Efficiency: VπL < 3Vcm
Co-planar waveguides
Loss @ 30 GHz < 4 dB/cm
Intensity modulators
70 GHz bandwidth (3dB)
PDK Access
Pilot Multi-Project Wafer Runs
MPW design submission deadline
03 February 2025 (LN006)
MPW design submission deadline
02 June 2025 (LN007)
MPW design submission deadline
01 October 2025 (LN008)
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